| 摘要 |
A wafer cleaning apparatus for cleaning wafers for manufacturing semiconductor devices is provided. The wafer cleaning apparatus includes a chuck for chucking a wafer to be cleaned, means for rotating the wafer chucked by the chuck, a cleaning solution spray nozzle for spraying a cleaning solution toward the top surface of the wafer rotated by the rotating means, at least two brushes installed to be moved horizontally above the wafer with a predetermined distance spaced apart from the top surface of the wafer in a contact state with the sprayed cleaning solution, and brush moving means for selectively moving the respective brushes horizontally above the wafer, wherein distances between the top surface of the wafer and lower ends of the respective brushes are different from each other when the respective brushes clean the wafer as horizontally moving above the wafer. Therefore, the cost for providing the wafer cleaning apparatus may be reduced because the wafer cleaning apparatus is adapted to clean wafers having layers of various kinds at their topmost layers. Also, the cost and space for installing the wafer cleaning apparatus can be reduced.
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