| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated sheet which has high deflection resistance and can decrease generation of warpage after it is processed into a multi-layer printed-wiring board. SOLUTION: The laminated sheet is obtained by heat pressure molding of a glass fiber woven fabric base material impregnated with a heat-curable resin composition. In the laminated sheet with a sheet thickness of 0.1-0.3 mm, when the laminated sheet with a width of 5 cm is supported between two support points with a distance between the support points of 10 mm and a load is applied thereon, an amount of displacement per weight obtained by dividing a distance (the unit is mm) of deflection of the laminated sheet by the load (the unit is g) is divided by the reciprocal of the sheet thickness to obtain a value of 0.003-0.045 as a strain index. In the thin laminated sheet with a sheet thickness of 0.1-0.3 mm, the laminated sheet with the strain index in a range of 0.003-0.045 exhibits high rigidity and high deflection resistance. COPYRIGHT: (C)2004,JPO |
