| 摘要 |
PURPOSE: To prevent the position of a semiconductor chip from deviating when soldering second and third lead terminals to both electrode parts of the semiconductor chip for a three-terminal device and the semiconductor chip to the island part of a first lead terminal. CONSTITUTION: A semiconductor chip has electrode parts 9a and 9b protruding on its upper surface. The size of an island part 5a is made nearly equal to that of the semiconductor chip or a notch groove is made at a part outside the semiconductor chip out of the upper surface of the island part, thus preventing the melted solder from being spread. |
