发明名称 |
Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer |
摘要 |
The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones in the aspect ratio of a circuit pattern when processed to a printed wiring board comprising a fine-pitch circuit. The object of the present invention is achieved by manufacturing a printed wiring board with the use of a copper clad laminate with a copper-plated circuit layer characterized by a copper-plated circuit layer and an outer-layer copper foil layer that satisfied the relationship in a case where a specific etchant is used, the R v value (Vsc/Vsp), which is the ratio of the dissolution rate (Vsp) of deposited copper that constitutes said copper-plated circuit layer to the dissolution rate (Vsc) of copper that constitutes said outer-layer copper foil layer, is 1.0 or more.
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申请公布号 |
US6652993(B2) |
申请公布日期 |
2003.11.25 |
申请号 |
US20020131222 |
申请日期 |
2002.04.25 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
YAMAMOTO TAKUYA;SYOUJIGUCHI TAKASHI |
分类号 |
C25D5/48;C23F1/00;C23F1/02;C23F1/18;C25D7/00;H05K1/09;H05K3/06;H05K3/10;H05K3/18;(IPC1-7):B32B15/01 |
主分类号 |
C25D5/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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