发明名称 |
Packaged semiconductor and process for manufacturing the same |
摘要 |
A method of manufacturing a packaged semiconductor device includes mounting a semiconductor device having multiple leads. The leads are formed by mounting the semiconductor device in a lead frame and punching and sealing the leads in the semiconductor device using a resin. The leads are bent to a predetermined configuration while substantially simultaneously bending a connecting member that is used for connecting the leads to a frame. The resulting packaged semiconductor device has leads that are not cut off from the lead frame, and the connection between the two can be maintained even after a bending process is finished.
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申请公布号 |
US6653169(B2) |
申请公布日期 |
2003.11.25 |
申请号 |
US20020057907 |
申请日期 |
2002.01.29 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
MATUMOTO JIROU |
分类号 |
H01L23/50;H01L21/48;H01L21/60;H01L23/495;(IPC1-7):H01L21/44;H01L21/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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