发明名称 Alternate bump metallurgy bars for power and ground routing
摘要 An apparatus, including a die having a surface, further including an array of electrically conductive bumps; and a plurality of electrically conductive bars positioned within the array of electrically conductive bumps.
申请公布号 US6653563(B2) 申请公布日期 2003.11.25
申请号 US20010823427 申请日期 2001.03.30
申请人 INTEL CORPORATION 发明人 BOHR MARK T.
分类号 H01L23/485;H01L23/50;H01L23/528;(IPC1-7):H05K5/00 主分类号 H01L23/485
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