发明名称 ELECTRIC CONNECTION STRUCTURE OF ELECTRONIC WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To downsize a board support and an electronic board by narrowing the interval between the connection pads on a bus bar side, in the electric connection structure of the electronic board where the electronic board is fixed to the board support made of synthetic resin wherein a plurality of bus bars made by stamping are buried and a plurality of pads on bus bar side ranging integrally from each bus bar are juxtaposed in parallel on the surface of the board support outside of the electronic board and a plurality of connecting pads on board side juxtaposed in parallel on the electronic board are connected to the connection pads on bus bar side. <P>SOLUTION: The connection pads 76 on bus bar side are juxtaposed in the board support 64, with their sides where burr 92 arise when stamping the bus bars 73A integrated with the connection pads 76 on bus bar side being buried in the board support 64. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003333731(A) 申请公布日期 2003.11.21
申请号 JP20020140322 申请日期 2002.05.15
申请人 NISSIN KOGYO CO LTD;IWATAKI GIKEN KK 发明人 AMANO TSUTOMU;IWATAKI YUKIO
分类号 B60T8/34;H02G3/16;H05K7/06;(IPC1-7):H02G3/16 主分类号 B60T8/34
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