| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave element reduced in size. SOLUTION: A surface acoustic wave filter 21 includes: a piezoelectric board 23; and an interdigital transducer 24. In the filter 21, membrane bumps 31 extending in the length direction of a bus-bars 27, and having an elongated flat shape, are formed on the bus-bars 27 in the interdigital transducer 24 by a deposition lift-off method. The surface acoustic wave filter 21 is mounted on a board via the bumps 31 by flip chip bonding. COPYRIGHT: (C)2004,JPO
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