| 摘要 |
PROBLEM TO BE SOLVED: To simultaneously perform an improvement in the heat sink efficiency of a heat generated from an electric circuit element and maintaining of the mechanical strength of a second printed substrate. SOLUTION: A heat sink plate 2 for supporting the electric circuit element 3 and the second printed substrate 5 are stood on a first circuit board 1. The plate 2 and the substrate 5 are bridged by using a heat sink member made of a bar-like metal material. Thus, the number of the components can be reduced and space-saving can be performed. COPYRIGHT: (C)2004,JPO
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