发明名称 MULTIHEAD POLISHING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a triple platen type polishing apparatus in which an operating rate is improved by operating three platens effectively at a maximum. <P>SOLUTION: A multihead polishing apparatus 10 provided with three polishing plates of a first polishing plate 34A, a second polishing plate 34C and a third polishing plate 34B is equipped with at least three polishing heads of a first polishing head 38A, a second polishing head 38B and a third polishing head 38C, and a control means 70 is provided for organically controlling the movements of the respective polishing heads relatively to the respective polishing plates to minimize idle time of each of the three polishing heads. Thus, the triple platen type polishing apparatus in which the operating rate is improved by operating the three platens effectively at a maximum is obtained. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332282(A) 申请公布日期 2003.11.21
申请号 JP20020142624 申请日期 2002.05.17
申请人 TOKYO SEIMITSU CO LTD 发明人 INABA TAKAO
分类号 B24B37/04;H01L21/304 主分类号 B24B37/04
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