| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To share the use of a probe-card boards in order to reduce manufacturing cost thereof and shorten manufacturing term therefor. <P>SOLUTION: The arrangement of a plurality of bonding pads 1 is determined according to every design rule, followed by completing a layout design for individual function blocks and then selecting the bonding pads 1 after the arrangement determination. In this case, the plurality of bonding pads 1 are arranged so as to have a minimum interval 2 therebetween, to provide the probe-card board that matches with this arrangement. In designing chips for a multilayer AL wiring, a layer for only bonding pads is provided at the uppermost level for predetermining the arrangement of the bonding pads thereon. <P>COPYRIGHT: (C)2004,JPO</p> |
