发明名称 METHOD FOR MANUFACTURING COMPONENT MULTILAYER MOUNTING ELEMENT AND ELEMENT MANUFACTURED BY THE METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a component multilayer mounting element wherein a components can be vertically overlapped and mounted without forming trenches in a substrate, when the components are mounted in multilayers and an element having a prescribed function is manufactured, manufacturing is easy, productivity can be improved, and cost reduction is enabled, and to provide an element manufactured by the method. SOLUTION: A large number of first components 32 and retaining parts 34 are mounted in such a manner that the first component 32 is set as reference above a base 31, and two or more retaining parts 34 are arranged around the first component. The whole surface of a base 31 on which the first component 32 and the retaining parts 34 are mounted is subjected to molding treatment. After the base 31 subjected to the treatment is cut every element size, a second component 35 is mounted on the upper part of each cut segment, thereby completing the component multilayer mounting element. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332516(A) 申请公布日期 2003.11.21
申请号 JP20020185671 申请日期 2002.06.26
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 YOU JAE IL;KIM JONG-TAE
分类号 H01L25/00;H01L21/56;H01L25/10;H03B5/32;H05K1/18;(IPC1-7):H01L25/00 主分类号 H01L25/00
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