BUMP OF SEMICONDUCTOR CHIP, MANUFACTURING METHOD THEREOF, AND COG PACKAGE USING THE SAME

摘要

PURPOSE: A bump of a semiconductor chip, a manufacturing method thereof, and a COG package using the same are provided to be capable of preventing electrical short when mounting a semiconductor chip on a PCB(Printed Circuit Board) even though the interval between metal pads of the semiconductor chip is considerably narrow. CONSTITUTION: A predetermined integrated circuit device is formed at a semiconductor chip(100). A plurality of metal pads(180) are formed at the upper portion of the semiconductor chip. A sidewall insulating layer(210) is formed for enclosing the metal pads. At this time, the sidewall insulating layer has a contact at the center portion. The contact is filled with a metal bump, wherein the metal bump is electrically connected with the metal pad. Preferably, the sidewall insulating layer is made of a polymide layer or epoxy.