发明名称 Nickel electroplating solution
摘要 Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 5 to 7, and a ratio of nickel ions to chloride ions of greater than 1.
申请公布号 US2003213699(A1) 申请公布日期 2003.11.20
申请号 US20020330419 申请日期 2002.12.27
申请人 SHIPLEY COMPANY, L.L.C. 发明人 KONDO MAKOTO;ENOMOTO HARUKI;SHIMAZU MOTOYA
分类号 C25D3/12;C25D5/54;(IPC1-7):C25D3/12 主分类号 C25D3/12
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