| 摘要 |
PURPOSE: An inking apparatus of a semiconductor chip inspection system is provided to be capable of reducing the bake time and workforce by simultaneously performing baking and inking processes using a coil. CONSTITUTION: An inking apparatus comprises a wafer chuck for loading wafers(10), an inker(130) for inking semiconductor chips, and a control part. The inking apparatus further includes a heat generator formed at the wafer chuck for heating the wafer(10), so that the inking and baking are simultaneously carried out. At this time, the heat generator is provided with a coil(122) for generating heat used for baking and a temperature sensor for sensing the temperature of the chuck.
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