发明名称 |
Polishing pad sensor assembly with a damping pad |
摘要 |
A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly. A damping pad may be disposed on the optical assembly to reduce vibrations and further increase the sensitivity of optical measurements.
|
申请公布号 |
US2003216108(A1) |
申请公布日期 |
2003.11.20 |
申请号 |
US20020216107 |
申请日期 |
2002.08.08 |
申请人 |
BARBOUR GREG |
发明人 |
BARBOUR GREG |
分类号 |
B24B37/00;B24B37/04;B24B49/12;B24D7/12;B24D13/14;H01L21/304;(IPC1-7):B24B49/00;B24B51/00 |
主分类号 |
B24B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|