| 摘要 |
PROBLEM TO BE SOLVED: To obtain a cured product showing excellent flame retardance and reliability in terms of humidity resistance by using a semiconductor-sealing, flame-retardant epoxy resin composition showing excellent moldability. SOLUTION: The epoxy resin composition essentially comprises (A) an epoxy resin, (B) a hardener, (C) an inorganic filler, (D) a molybdenum compound wherein zinc molybdate is supported on the inorganic filler and (E) a phosphazene compound represented by average composition formula (1) (wherein R<SP>1</SP>is a hydrogen atom or a 1-4C alkyl group; R<SP>2</SP>and R<SP>3</SP>are each a hydrogen atom, a 1-4C alkyl group, an alkoxy group or a group chosen from NR<SP>4</SP>R<SP>5</SP>and SR<SP>4</SP>; X is O, S or NR<SP>6</SP>; R<SP>4</SP>-R<SP>6</SP>are each a hydrogen atom or a 1-4C alkyl group; and a, b and n satisfy 0<a≤2n, 0≤b<2n, a+b=2n and 3≤n≤1,000) and is substantially free from bromides and antimony compounds. A semiconductor device is sealed with the cured product of the composition. COPYRIGHT: (C)2004,JPO
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