| 摘要 |
PROBLEM TO BE SOLVED: To provide dummy balls for barrel plating which hardly cause contamination in a plating bath, have reduced deformation caused by collision and are used, e.g. when an external electrode is formed on the surface of electronic parts by electroplating. SOLUTION: The dummy balls for barrel plating consist of metallic balls with Cu as a major component. As for the metal with Cu as a major component, metal containing Ni, P, Sn, Al, Si or the like to such a degree that the plating bath is not contaminated can be used for increasing their hardness compared with a Cu simple substance. The alloy based balls are advantageous to the elongation of the lives of the dummy balls and the stabilization of the thickness of a terminal plating film. COPYRIGHT: (C)2004,JPO
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