SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To realize the lowering of the manufacturing cost of a semiconductor device while improving yield by providing a method and its structure capable of reducing the number of processes in manufacturing the semiconductor device.

SOLUTION: In this semiconductor device, respective wirings (source wirings and drain wirings and the like) which are formed in a row direction and a column direction are formed with the same conductive film on an element substrate. Moreover, in this case, after a wiring of one side of the row direction or the column direction is discontinuously formed at parts where these wirings intersect and insulating films are formed on these wirings, a continuous wiring is formed by forming connection wirings for connecting discontinuous wiring with the same film as that of an electrode (this is referred to as a first electrode in the following) which is formed on the insulating films.

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