发明名称 |
CROSSLINKED POLYESTER RESIN MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin molding having high flame-retardancy and heat resistance suitable for electronic parts, wherein the flame-retardancy fulfills the UL standard 94V-0 and the reflow resistance of 260°C×60 seconds which enables surface-mounting process by a lead-free solder. SOLUTION: The crosslinked polyester resin molding has the flame-retardancy fulfilling the standard value of V-0 by the UL-94 test of the UL standard and the storage elastic modulus at 260°C of≥2.0 MPa. The crosslinked polyester resin is molded from resin composition (I) containing at least a thermoplastic polyester resin and a flame-retardant and exposed to ionizing radiation to be crosslinked. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2003327713(A) |
申请公布日期 |
2003.11.19 |
申请号 |
JP20020136699 |
申请日期 |
2002.05.13 |
申请人 |
SUMITOMO ELECTRIC FINE POLYMER INC |
发明人 |
OKABE SHOHEI;HAYAMI HIROSHI;NISHIKAWA SHINYA |
分类号 |
C08J5/00;C08F283/00;C08F283/01;C08J7/00;C08K3/26;C08K5/00;C08L67/00;(IPC1-7):C08J5/00 |
主分类号 |
C08J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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