LINKING METHOD FOR FINE PARTICLES, SUBSTRATE HAVING FINE PARTICLES LINKED THEREBY, CIRCUIT ELEMENT, AND OPTICAL ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a linking method for fine particles whereby fine particles are easily linked to each other on the surface or in the inside of a substrate with excellent workability. SOLUTION: This method for linking fine particles comprises a process (A) of incorporating fine particles in a non-linked state into a substrate and a process (B) of linking the fine particles to each other on the surface and/or in the inside of the substrate by the irradiation with a converged laser beam from the outside of the substrate. The substrate is preferably a plastic one. The fine particle is preferably an inorganic particle, which may contain at least one kind of metal atoms selected from gold, silver, copper, platinum, and titanium or may contain silicon atoms. COPYRIGHT: (C)2004,JPO