| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for an electrical component capable of uniformizing a contact pressure of a terminal and a contact pin by the same contact pin even when IC packages with different diameters are attached. SOLUTION: In the IC socket, a holding face part holding the IC package is provided on a socket body, a plurality of contact pins 15 capable of contacting and separating with respect to solder balls 12b of the IC package are arranged side by side on the socket body, a moving plate 1 is provided movably with respect to the socket body, and by moving the moving plate 1, elastic pieces 15b of the contact pins 15 are elastically deformed, contact parts 15h provided on tips of the elastic pieces 15b are displaced, and they are separated from side face parts of the solder balls 12b of the IC package 12. A moving range of the moving plate 17 can be adjusted, and a deformation amount of the elastic pieces 15b can be changed in response to a diameter of the solder balls 12b. COPYRIGHT: (C)2004,JPO
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