| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer suction device free from a handling failure even when the suction device attracts an wet wafer. SOLUTION: The wafer suction device 10 comprises a suction pad 44, a suction tube 46 composed of a main line 46a and a sub-line 46b, etc. In a state that an open/close valve 48 arranged in the sub-line 46b is closed in advance, a wafer W is vacuum-sucked to the suction pad 44 by sucking air via the main line 46a. Moisture remaining on the surface of the wafer W is sucked into the main line 46a. Then, the open/close valve 48 is opened. Herewith, without the infiltration of the moisture in the sub-line 46b, the wafer W is steadily sucked to the suction pad 44 for holding the wafer, which can prevent the malfunction of a vacuum sensor and eliminate the handling failure. COPYRIGHT: (C)2004,JPO |
