发明名称 SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a soldering method which can control the volume of solder for each soldering point and can attain a desired soldering volume in order to prevent a variation in printing volume, failure in shape, generation of blur, and wear of squeeze. SOLUTION: Solder pellets 8 are mounted together with surface mounting components 7 on a cream-soldered layer 8 which has been formed by printing on a land of a printed circuit board 2 or the like, and these pellets 8 are fused for a soldering purpose. Moreover, the solder pellet is manufactured as a pellet having the same composition as the solder in the cream-solder in the volume which is equal to the difference between the volume of solder in the cream- solder and the volume of solder required for each soldering point. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003324271(A) 申请公布日期 2003.11.14
申请号 JP20020129636 申请日期 2002.05.01
申请人 MITSUBISHI ELECTRIC CORP 发明人 SUGIHARA TAKESHI
分类号 B23K1/00;B23K3/06;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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