发明名称 SUBSTRATE PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide technology for preventing transport waiting of a substrate by a substrate transport means, which is caused when a dummy dispensation is performed in a liquid processor. <P>SOLUTION: A wafer in a cassette C of a cassette station 21 is transferred to TRS1 of a processing part S1 by a transfer means 24 at prescribed timing. The substrate transfer means 28A and 26B transport the wafer of TRS1 to a coating device 4A, a processing unit heating and cooling the wafer and a developing device 4B by a prescribed route. When the dummy dispensation is performed between a front lot and a back lot in the coating device 4A, the last wafer in the front lot is transferred from the cassette station 21 to the substrate transport means 26A through TRS1, and transfer of the first wafer in the back lot to TRS1 by the transfer means 24 is stopped for the prescribed number of times so that the first wafer of the back lot is transported to the coating device 4A from CPL1 after the dummy dispensation is terminated. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003324059(A) 申请公布日期 2003.11.14
申请号 JP20020129976 申请日期 2002.05.01
申请人 TOKYO ELECTRON LTD 发明人 MIYATA AKIRA
分类号 G03F7/16;G03F7/30;H01L21/00;H01L21/027;H01L21/677 主分类号 G03F7/16
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