发明名称 |
Multi-chip package having improved heat spread characteristics and method for manufacturing the same |
摘要 |
A multi-chip package (MCP) in which heat generated in first and second chips of the MCP is spread effectively and a method for manufacturing the same. The MCP includes first and second chips. The MCP further comprises a tape including a conductive material layer therein situated between the first chip and the second chip. Thus, the heat generated in the second chip can effectively spread to the outside through the tape.
|
申请公布号 |
US2003210533(A1) |
申请公布日期 |
2003.11.13 |
申请号 |
US20030410011 |
申请日期 |
2003.04.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BAEK JOONG-HYUN;LEE TAE-KOO;KIM MIN-HA;IM YUN-HYEOK |
分类号 |
H01L23/34;H01L23/12;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H05K7/02;H05K7/06;H05K7/08;H05K7/10 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|