| 摘要 |
An electrode apparatus for electroplating a metal overlay on a substrate having a front surface, a back surface, and a seed layer deposited on all surfaces. The apparatus includes a cell for containing and circulating an electrolyte; an annular sealing fixture having a "J" shaped cross section for supporting the peripheral front surface of the substrate. The substrate is supported above the cell by the shorter and inner member of the "J" shape. A multiplicity of compliant electrode fingers are inwardly mounted with a downward tilt angle, the compliant fingers are equally spaced about the inner periphery of the longer "J" member. The compliant fingers make conductive cathodic contact with the seed layer at the peripheral edge of the substrate. A pressure is applied to the back surface of the substrate. The pressure effects a wiping action between the compliant fingers and the peripheral edge while holding the substrate against the sealing fixture. A counter electrode is proximally placed towards the bottom of the cell and is circuitous arranged for passing current between the counter electrode and compliant electrode fingers. A pump circulates the electrolyte against the front surface of the substrate.
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