| 发明名称 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE |
| 摘要 |
The invention relates to the manufacture of a semiconductor device ( 10 ) which is suitable for surface mounting of a semiconductor body ( 1 ) provided with connection regions ( 2 ) for, for example, a diode. In a method, a flexible foil ( 6 ) comprises a conductor pattern ( 4 ) and an insulating layer ( 3 ), and is detachably secured, on the side of the conductor pattern ( 4 ), to a substrate ( 7 ). |
| 申请公布号 |
EP1360722(A2) |
申请公布日期 |
2003.11.12 |
| 申请号 |
EP20020740056 |
申请日期 |
2002.01.21 |
| 申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
VAN VEEN, NICOLAAS, J., A.;DE SAMBRE, MARC, A.;WEISS, THOMAS |
| 分类号 |
H01L23/12;H01L23/498;H01L21/56;H01L21/68;H01L21/683;H01L23/31 |
主分类号 |
H01L23/12 |
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