发明名称 |
Polishing articles for electrochemical mechanical polishing of substrates |
摘要 |
An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article (205) having a body comprising at least a portion (310) of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations (546) and a plurality of grooves (542) may be formed in the articles to facilitate flow of material through and around the polishing article. <IMAGE>
|
申请公布号 |
EP1361023(A2) |
申请公布日期 |
2003.11.12 |
申请号 |
EP20030252801 |
申请日期 |
2003.05.02 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HU, YONGQI;WANG, YAN;DUBOUST, ALAIN;LIU, FENG Q.;MAVLIEV, RASHID;CHEN, LIANG-YUH;MORAD, RATSON;SOMEKH, SASSON |
分类号 |
C25D7/12;B23H5/08;B24B37/04;B24D13/14;C25F3/00;C25F3/30;C25F7/00;H01L21/304;(IPC1-7):B24D13/14;H01L21/321 |
主分类号 |
C25D7/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|