| 发明名称 |
INTEGRATED CIRCUIT ARRANGEMENT CONSISTING OF A FLAT SUBSTRATE |
| 摘要 |
An integrated circuit is formed on a non-planar substrate. The integrated circuit is formed over a plurality of layers. Chemical or physical changes in the microstructure of the substrate cause the bending of the substrate, in one or more propagation directions. |
| 申请公布号 |
EP1360718(A2) |
申请公布日期 |
2003.11.12 |
| 申请号 |
EP20020703497 |
申请日期 |
2002.01.22 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
JANKE, MARCUS;LAACKMANN, PETER |
| 分类号 |
H01L21/52;H01L23/13;H01L23/58;H01L29/06;(IPC1-7):H01L23/13 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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