发明名称 Method of adjusting component airflow
摘要 A method of adjusting airflow through a plurality of cooling holes (32) by depositing a thermal barrier coating (36) on an exterior surface (34) and/or an interior surface of the component (16) by a physical vapor deposition process. The cooling holes (32) are not masked. Thus, a portion (38) of the thermal barrier coating (36) partially obstructs airflow through the cooling holes (32) and reduces airflow through the cooling holes (32). A predetermined pressure drop is developed across the cooling holes (32) and airflow through the cooling holes (32) is measured. The measured airflow is compared to a preselected range of desired cooling hole airflows and the steps of depositing the thermal barrier coating (36), developing the predetermined pressure drop, calculating airflow and comparing the measured airflow to the preselected range are repeated until the measured airflow is within the preselected range of desired cooling hole airflows. <IMAGE>
申请公布号 EP1174587(A3) 申请公布日期 2003.11.12
申请号 EP20010306168 申请日期 2001.07.18
申请人 GENERAL ELECTRIC COMPANY 发明人 CALDWELL, JAMES MICHAEL;FARMER, GILBERT;FESSENDEN, KARL STEPHEN;WANG, XUENAN;KAUFFMAN, JERALD MICHAEL
分类号 F02C7/18;C23C14/04;F01D5/18;F01D5/28;F02C7/00;(IPC1-7):F01D5/18;C23C16/04;C23C4/00 主分类号 F02C7/18
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