| 摘要 |
A method for cooling electronic components comprising drawing air into a chassis; causing the air to come in contact with a corrugated deflector; and cooling electronic components with the air before the air exits the chassis. A fail safe system for cooling electronic components comprising a corrugated deflector; a plurality of fans, positioned such that they cause air to come in contact with the corrugated deflector; and an electronic component; wherein the electronic component is cooled by the air.
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