| 摘要 |
A substrate cleaning apparatus for cleaning a rotating substrate has a scrub cleaning tool for cleaning the substrate by bringing the cleaning tool into contact with the substrate, a liquid jet spray nozzle for cleaning the substrate by yet-spraying a cleaning liquid from the nozzle to the substrate, and a swing mechanism for simultaneously swinging both of the scrub cleaning tool and the liquid jet spray nozzle on and above the substrate. The substrate cleaning apparatus also has a cleaning tool vertical driving mechanism for moving at least the cleaning tool from a position where the cleaning tool is in contact with a surface of the substrate to another position where the cleaning liquid jet-sprayed from the nozzle is applied to the cleaning tool, by vertically moving the cleaning tool.
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