| 摘要 |
PROBLEM TO BE SOLVED: To realize a high density mounting structure which has a simple composition capable of conductively connecting electronic components to corresponding electrode patterns, irrespective of the pitch of the patterns, in a comparatively short time. SOLUTION: The semiconductor device is composed of electronic components 10 mounted on one surface 2b of a substrate, corresponding to a specified electrode pattern formed on this surface and external-connecting electrodes 3 which are conductively connected to an electrode pattern and formed on the other surface 2A of the substrate. Among the electronic components at least a semiconductor chip 9 is mounted on the one surface of the substrate through an anisotropic conductive film 31. |
