| 发明名称 |
LOW LOSS DIELECTRIC MATERIAL FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGING |
| 摘要 |
<p>Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.</p> |
| 申请公布号 |
AU2003225163(A1) |
申请公布日期 |
2003.11.10 |
| 申请号 |
AU20030225163 |
申请日期 |
2003.04.25 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
GEORGE, ELIAS ZAHR;PUI-YAN LIN;GOVINDASAMY, PARAMASIVAN RAJENDRAN |
| 分类号 |
C08J5/04;C08K7/02;C08L25/10;C08L53/02;D03D15/12;D04H1/42;D06M15/233;D06M15/263;D21H13/26;D21H13/40;D21H19/20;H05K1/03;(IPC1-7):H05K1/03;C08J5/24 |
主分类号 |
C08J5/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
