发明名称 LOW BAR BONDING DEVICE FOR THIN-FILM MAGNETIC HEAD
摘要 PROBLEM TO BE SOLVED: To obtain a uniformly treated surface when a plurality of low bars having a variation in thickness are bonded to a holding fixture. SOLUTION: The low bar bonding device 20 has a first mounting means 1 of a rectangular parallelepiped shape for mounting prescribed surfaces 12 of a plurality of the low bars 10 having a plurality of thin-film magnetic head elements 11 on a plane, a second mounting means 2 for mounting the holding fixture 13 provided with an adhesive layer 14, and an opposing and holding device 8 for opposing and holding the first and second mounting means to each other. At least either of the first and second mounting means is preferably provided with vacuum suction means 3 and 4 for vacuum sucking a plurality of the low bars or the holding fixture. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003317416(A) 申请公布日期 2003.11.07
申请号 JP20020124364 申请日期 2002.04.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUENAGA TATSUTOSHI;YOSHIJI YOSHINORI;ITO SADAYOSHI;NAKAGAMI RYUICHI;TAGASHIRA KOZO
分类号 G11B5/31;G11B5/60;G11B21/21;(IPC1-7):G11B21/21 主分类号 G11B5/31
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