| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that large chipping is caused at the time of dicing in a method of bonding and dicing film-like die bonding materials to the back side of a conventional back-ground and thinned wafer. SOLUTION: In a film-like die bonding material 3, notches 5 are previously put at equal intervals at a pitch of 50μm, for example. Then, a wafer is set in a chip mounter, and a chip is lifted by a pick up head 6. The film-like die bonding material 3 is cut into approximately the same size as the chip from the notches 5 at the equal intervals to perform chip mounting through thermocompression bonding. The voids due to the notches in the interface between the back side of the chip and the film-like die bonding material can be crushed by the heat and load after mounting, if the thermoplastic film-like die bonding material is used. COPYRIGHT: (C)2004,JPO |
