| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a device for cooling heat generated from a semiconductor element having a power of about 70 W can be constituted by a conventional air-cooled cooling device having a fan and a heat sink, however, when a semiconductor element generating heat higher than 150 W is cooled, the size of the device becomes so extremely large that the device can not be received into a frame body such as a server or the like. SOLUTION: A refrigerant circulation type cooling device is constituted of a cooling plate for cooling a high heat generating body or the semiconductor element, a condenser and a refrigerant pump which are connected in series. The condenser is cooled by a fan and is constituted of a flat tube condenser and the copper-made cooling plate. COPYRIGHT: (C)2004,JPO |
