| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique which can improve manufacturing yield by reducing contact defect of a lead of an LCD driver. SOLUTION: A pad 4 is formed in a surface of a semiconductor chip 1 wherein an LCD driver circuit is formed. An opening part 7 exposing the pad 4 is formed in a passivation film 5 covering the pad 4. The opening part 7 is formed relatively long in a direction wherein the lead 6 is inserted for allowing the lead 6 to get into easily. A bump 9 connected to the pad 4 is formed in an upper layer of the passivation film 5. The lead 6 mounted on a TCP, for example, is adhered to the bump 9. The bump 9 is formed in a region including the opening part 7 over the passivation film 5. As a result, it is formed to a recessed shape following the step of the opening part 7. COPYRIGHT: (C)2004,JPO |
