| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated wiring board and a multilayer wiring assembly wherein heat radiation is superior, reliability of soldering of a surface mounted part and reliability of through hole connection are high, and high density mounting can be realized. SOLUTION: A core material 1 uses a carbon aluminum with low thermal expansion and high heat radiation, in which a carbon molded body is impregnated with a melted aluminum, and a first wiring layer 5 is arranged on the core material 1 with a polymer coat 2, a resin 3 for hole filling with high heat resistance and low thermal expansion, and a pre-preg 4 for adhesion interposed, forming the laminated wiring board 10. Two laminated wiring boards 10 with a single-sided wiring layer are prepared, and the first wiring layers 5 are opposite to each other and a double-sided copper-clad laminated board 6 and the pre-preg 4 are alternately arranged between two laminated wiring boards 10, and furthermore, a third wiring layer 9 made of copper foil is arranged as an outer layer of the laminated wiring board 10, resulting in a carbon aluminum multilayer printed wiring board 100 wherein heat radiation is superior, reliability of soldering of a surface mounted part and reliability of through hole connection are high, and high density mounting can be realized. COPYRIGHT: (C)2004,JPO |
