| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate in which signal wirings extended from signal terminals disposed in three rows at an outer peripheral side can be simultaneously led to the outer peripheral side in the multilayer wiring substrate having a flip-chip type IC chip is mounted on the main surface of the substrate. SOLUTION: The multilayer wiring substrate 101 comprises: a terminal 121 having a plurality of signal terminals 121S disposed in three rows of the outer peripheral side to transmit signals; and a plurality of first signal via conductors 123S for directly or indirectly connected to the signal terminals 121S disposed 1:1 in the three rows. The terminal 121 is connected to the first signal via conductor 123A connected indirectly to the terminal 121S via a plurality of shift wirings 122. The substrate 101 further comprises a plurality of lead wirings 133 connected 1:1 to a third signal via conductor 131S and extended toward the outer peripheral side. COPYRIGHT: (C)2004,JPO
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