LED LIGHT SOURCE AND ITS FABRICATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an LED light source in which the optical characteristics are made uniform and a bonding wire is prevented from being exposed.

SOLUTION: The LED light source comprises a substrate 2 where a pad 22 for LED consisting of a chip placing pad 22a and a wire bonding pad 22b is formed on the upper surface of a basic material, an LED chip 31 placed on the chip placing pad 22a and connected with the wire bonding pad 22b through a bonding wire 32, and a translucent resin 33 for molding the LED chip 31 wherein an oil-repellent film 26 is provided on the upper surface of the substrate 2 to surround the pad 22 for LED.

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