SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To manufacture a high-performance stacked semiconductor device which can satisfy reduction in mounting height, mounting area and weight, by means of an existing production line at a low cost.

SOLUTION: A non-lead type semiconductor device comprises a sealing body formed of insulating resin; tab to mount a semiconductor chip on; a plurality of leads with one face of each being exposed on the mounting face of the sealing body; a first semiconductor chip which is positioned in the sealing body and has a first face which is a circuit formation face, and a second face opposite to the first face which is supported on one face of the tab by the second face via an adhesive; a plurality of electrode pads formed in the periphery of the first face of the first semiconductor chip; conductive wires for electrically connecting the electrode pads and the leads; a second semiconductor chip which has the first face which is a circuit formation face, and a second face which is stacked on the first semiconductor chip with the second face facing the first face of the first semiconductor chip; a plurality of electrode pads formed on the first face of the second semiconductor chip; and conductive wires for electrically connecting the electrode pads of the second semiconductor chip and the leads.

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