| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of equipment and, at the same time, to improve the production efficiency of a method of bonding electronic component, by reducing the installed number of bump forming devices used for forming bumps at the time of mounting a plurality of types of electronic components on one substrate. SOLUTION: Bumps which are adaptive to a plurality of types of electronic components are formed efficiently by using one bump forming device provided with a plurality of conductive liquid injection heads 5-7 having different exit doses, by selectively using the heads 5-7 in accordance with the types of the electronic components. COPYRIGHT: (C)2004,JPO
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