| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively prevent peeling of a land even when lead-free solder is used. SOLUTION: A wiring board is provided with a substrate 11 having a through hole 12, a first conductive film 13 coating the internal surface of the hole 12, and the land 15 formed on the surface of the substrate 11 around the opening of the hole 12 and composed of a second conductive film connected to the first conductive film 13. The wiring board is also provided with circuit wiring 16 formed on the surface of the substrate 11 and connected to the land 15, a protective film 17 covering the wiring 16, and a coating member 18 coating at least part of the outer peripheral edge 15A of the land 15. COPYRIGHT: (C)2004,JPO
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