| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem such that a platinum temperature sensor using a platinum thin film, which is a temperature-sensing element, as an electrode has lo reliability at a lead connecting part due to stress imposed on the platinum thin film when welding or bonding a lead wire thereto. SOLUTION: Two holes are formed beforehand on a plate-shaped insulating substrate, and a platinum thin film is formed thereon. An electrode is formed such that the hole is located at the center of the electrode using a thick film material mainly including platinum. After the lead wire is connected to the electrode, the electrode is pulled out to the back side of the substrate. Since stress generated when welding or bonding a lead wire is not applied on the platinum thin film and the lead connecting part and the back side of the substrate are fixed by a grass material, the platinum temperature sensor having good reliability at a lead connecting part can be provided. COPYRIGHT: (C)2004,JPO
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