Method of connecting circuit boards

摘要

The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another. In the heat-press-bonding step, the alkane group boils and cleans the surface of the printed wire terminals and conductive thick-film terminals, thereby removing the oxide film to expose the metallic portion of the terminals. The alkane group soaks into a thermoplastic film or base plate, causing it to swell and thereby bond the flexible circuit board to the printed circuit board tightly. Accordingly, both electrical and mechanical firm bonding is accomplished at a very low cost and short time.