| 摘要 |
PROBLEM TO BE SOLVED: To efficiently form a desired plating film only on a portion to be plated. SOLUTION: This plating method for manufacturing the desired electronic parts comprises subjecting an article to be plated, which has a Cu electrode formed on the surface, to steps between a degreasing step 11 and a rinsing step 14; giving a palladium catalyst in a catalyst-giving step 15; then promptly sending it to a catalyst-cleaning step 16 without carrying out rinsing; cleaning the catalyst in the catalyst-cleaning step 16 with a catalyst-cleaning agent containing, for instance, chloride ions and ammonium ions to selectively wash out the palladium catalyst directly adhering to a ceramic workpiece except the Cu electrode; and then subjecting it to a rinsing step 17→an electroless nickel plating step 18→a rinsing step 19→a dilute acid treatment step 20→a rinsing step 21→an Au displacement plating step 22 and a rinsing step 23. COPYRIGHT: (C)2004,JPO
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