发明名称 |
WIRING STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To reduce resistance of a wiring which receives a high frequency signal and has a length of several to tens of centimeters, and to reduce rounding of a signal waveform to be transmitted. SOLUTION: The wiring 111 applied with high frequency has such a wiring structure as electrically connected with the wiring 106 in parallel via a plurality of contact holes arranged along the longitudinal direction of the wiring 111 across an interlayer film 107. The rounding of the signal waveform can be reduced in the wiring applied with a high frequency signal by using the wiring structure for peripheral circuits of an active matrix type liquid crystal display device integrated with the peripheral circuits in one body. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2003315815(A) |
申请公布日期 |
2003.11.06 |
申请号 |
JP20030062708 |
申请日期 |
2003.03.10 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
KOYAMA JUN;OTANI HISASHI;OGATA YASUSHI;YAMAZAKI SHUNPEI |
分类号 |
G02F1/1343;G02F1/1345;G09F9/30;H01L21/3205;H01L23/52;H01L29/786;(IPC1-7):G02F1/134;G02F1/134;H01L21/320 |
主分类号 |
G02F1/1343 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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