| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film that is excellent in heat resistance, mold release properties, antifoulancy and follow-up properties to the unevenness of a circuit pattern and is excellent in cushioning properties, strength and dimensional stability at a hot-press molding temperature; that has excellent flame retardancy and low flame spread without containing a halogen flame retardant and is high in safety; and that is small in environmental load when subjected to waste disposal. SOLUTION: The mold release film has at least one layer formed from a resin composition which comprises 100 pts.wt. resin comprising at least one kind of a thermoplastic resin and/or a thermosetting resin and 0.1-100 pts.wt. phyllosilicate. COPYRIGHT: (C)2004,JPO
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